Topics Covered

What's Inside the Technical Overview

 

This technical brief provides a system-level engineering reference for data center architects, facility engineers, and project managers evaluating liquid cooling solutions for AI, HPC, and high-density computing environments.

 

The document covers BEEHE's integrated approach to liquid cooling—from primary-side heat rejection through secondary-side distribution to chip-level thermal management—along with deployment considerations, commissioning processes, and lifecycle support.

System Architecture

 

One-stop liquid cooling system covering primary-side and secondary-side cooling infrastructure

Cooling Technologies

 

Rack-level and chip-level cooling solutions including CDU, cold plates, and RDHX

Deployment Scenarios

 

Flexible configurations for new-build, retrofit, and hybrid data center environments

Lifecycle Support

 

Testing, commissioning, and operation & maintenance equipment and services
BeeHe In-Row L2L CDU Unit

In-Row L2L CDU

Cold Plate

Load Bank

Pipeline System

Quick Disconnect

In-Rack CDU

RDHX

Manifold

Air-cooled Chiller

Primary-Side Cooling

●  Oil-free, water-free air-cooled chillers
●  Magnetic levitation compressor technology
●  N+1 redundancy architecture

Secondary-Side Systems

●  L2L In-Row and In-Rack CDU configurations
●  L2A CDU and Sidecar solutions
●  SUS304 stainless steel piping systems

Rack & Chip-Level Cooling

●  Cold plate cooling for AI/HPC platforms
●  Rear Door Heat Exchangers (RDHX)
●  Manifolds and quick disconnects

Engineering & Deployment

●  Piping materials and engineering quality
●  Testing, flushing, and commissioning
●  Operation and maintenance equipment