BEEHE COOLING LOOP SERIES
INTEL EGS&BHS & AMD SP5&SP7
NVIDIA H100&B200&B300&GB200&GB300&MGX
PRODUCT FEATURES：
◆ Optimal channel design, low flow resistance, no corrosion risk
◆ Integrated connecting pipe location with a water tray, leakage detection design, safe and worry free
◆ Material: copper, skiving process, good thermal conductivity, low thermal resistance
◆ Brazing process, strong pressure bearing capacity, high reliability
◆ Special anti-corrosion treatment process for the exterior and interior of the flow channel, safe and reliable
◆ Standard leakage detection and alarm function
◆ Over 95% of brazing surface brazing rate, safe and leak free
◆ 100% ultrasound CT inspection, quality guarantee
◆ 100% air tightness, flow resistance, and cleanliness testing
◆ 100% draining and drying, nitrogen injection protection
CPU COLDPLATE TECHNICAL PARAMETERS：
|
Cooling object |
Intel EGS |
Intel BHS |
AMD SP5 |
AMD SP7 |
NVIDIA GB300 CPU |
|
Installation methods |
Spring screws |
Spring screws |
Spring screws |
||
|
Cold plate material |
Copper |
Copper |
Copper |
Copper |
Copper |
|
Coolant |
PG25 |
PG25 |
PG25 |
PG25 |
PG25 |
|
Connection pipe material |
EPDM |
PTFE + Silica gel |
EPDM |
EPDM |
SUS316L |
|
6Bar |
10Bar |
6Bar |
6Bar |
6Bar |
|
|
Flow of tests |
1.6LPM |
1.2LPM |
1.0LPM |
1.0LPM |
1.5LPM |
|
Pressure drop |
25kpa@1.2L/min |
17kpa@1.2L/min |
5kpa@1.0L/min |
12kpa@1.0L/min |
10.9Kpa@1.5L/min |
|
45℃ |
40℃ |
45℃ |
45℃ |
45℃ |
|
|
Tc/Tj |
@385W*2 Tc＜55℃ |
@550W*2 Tc＜62℃ |
@400W*2 Tc＜57.3℃ |
@600W*2 Tc＜70℃ |
@566W |
|
Thermal conductivity of TIM |
5.2W/m·K |
5.2W/m·K |
6.2W/m·K |
6.2W/m·K |
8W/m·K |
|
Connector |
UQD04 Socket |
UQD02 Socket |
UQD04 Socket |
UQD04 Socket |
NVQD03 plug |
